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Philips Semiconductors
Product specification
TrenchMOSTM transistor Standard level FET
GENERAL DESCRIPTION
N-channel enhancement mode standard level field-effect power transistor in a plastic envelope suitable for surface mounting. Using 'trench' technology the device features very low on-state resistance. It is intended for use in automotive and general purpose switching applications.
BUK7615-100A
QUICK REFERENCE DATA
SYMBOL VDS ID Ptot Tj RDS(ON) PARAMETER Drain-source voltage Drain current (DC) Total power dissipation Junction temperature Drain-source on-state resistance VGS = 10 V MAX. 100 75 230 175 15 UNIT V A W C m
PINNING - SOT404
PIN 1 2 3 mb gate drain (no connection possible) source drain DESCRIPTION
PIN CONFIGURATION
mb
SYMBOL
d
g
2 1 3
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL VDS VDGR VGS ID ID IDM Ptot Tstg, Tj PARAMETER Drain-source voltage Drain-gate voltage Gate-source voltage Drain current (DC) Drain current (DC) Drain current (pulse peak value) Total power dissipation Storage & operating temperature CONDITIONS RGS = 20 k Tmb = 25 C Tmb = 100 C Tmb = 25 C Tmb = 25 C MIN. - 55 MAX. 100 100 20 75 53 240 230 175 UNIT V V V A A A W C
THERMAL RESISTANCES
SYMBOL Rth j-mb Rth j-a PARAMETER Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS Minimum footprint, FR4 board TYP. 50 MAX. 0.65 UNIT K/W K/W
January 1999
1
Rev 1.000
Philips Semiconductors
Product specification
TrenchMOSTM transistor Standard level FET
STATIC CHARACTERISTICS
Tj= 25C unless otherwise specified SYMBOL V(BR)DSS VGS(TO) IDSS IGSS RDS(ON) PARAMETER Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Gate source leakage current Drain-source on-state resistance CONDITIONS VGS = 0 V; ID = 0.25 mA; Tj = -55C VDS = VGS; ID = 1 mA Tj = 175C Tj = -55C VDS = 100 V; VGS = 0 V; VGS = 20 V; VDS = 0 V VGS = 10 V; ID = 25 A Tj = 175C Tj = 175C MIN. 100 89 2 1 -
BUK7615-100A
TYP. 3.0 0.05 2 12.0 -
MAX. 4.0 4.4 10 500 100 15.0 40.5
UNIT V V V V V A A nA m m
DYNAMIC CHARACTERISTICS
Tmb = 25C unless otherwise specified SYMBOL Ciss Coss Crss td on tr td off tf Ld Ls PARAMETER Input capacitance Output capacitance Feedback capacitance Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Internal drain inductance Internal source inductance CONDITIONS VGS = 0 V; VDS = 25 V; f = 1 MHz MIN. TYP. 4500 550 305 35 85 150 70 2.5 7.5 MAX. 6000 660 400 55 125 225 100 UNIT pF pF pF ns ns ns ns nH nH
VDD = 30 V; Rload =1.2; VGS = 10 V; RG = 10
Measured from upper edge of drain tab to centre of die Measured from source lead soldering point to source bond pad
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tj = 25C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PARAMETER Continuous reverse drain current Pulsed reverse drain current Diode forward voltage Reverse recovery time Reverse recovery charge CONDITIONS MIN. IF = 25 A; VGS = 0 V IF = 75 A; VGS = 0 V IF = 75 A; -dIF/dt = 100 A/s; VGS = -10 V; VR = 30 V TYP. 0.85 1.1 80 0.35 MAX. 75 240 1.2 UNIT A A V V ns C
AVALANCHE LIMITING VALUE
SYMBOL WDSS PARAMETER Drain-source non-repetitive unclamped inductive turn-off energy CONDITIONS ID = 35 A; VDD 25 V; VGS = 10 V; RGS = 50 ; Tmb = 25 C MIN. TYP. MAX. 120 UNIT mJ
January 1999
2
Rev 1.000
Philips Semiconductors
Product specification
TrenchMOSTM transistor Standard level FET
BUK7615-100A
120 110 100 90 80 70 60 50 40 30 20 10 0
PD%
Normalised Power Derating
1 D= 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0
Zth / (K/W)
P D
tp
D=
tp T t
T
0
20
40
60
80 100 Tmb / C
120
140
160
180
0.001
0.00001
0.001
t/S
0.1
10
Fig.1. Normalised power dissipation. PD% = 100PD/PD 25 C = f(Tmb)
ID% Normalised Current Derating
Fig.4. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T
300 ID/A 250 VGS\V =
120 110 100 90 80 70 60 50 40 30 20 10 0
20.0
10.0
9.0 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5
200
150
100
50
0
20
40
60
80 100 Tmb / C
120
140
160
180
0
0
2
4
VDS/V
6
8
10
Fig.2. Normalised continuous drain current. ID% = 100ID/ID 25 C = f(Tmb); conditions: VGS 5 V
1000 ID/A RDS(ON) = VDS/ID 100
Fig.5. Typical output characteristics, Tj = 25 C. ID = f(VDS); parameter VGS
RDS(ON)/mOhm
20
tp = 1uS 100uS 1mS
19 18 17 VGS/V = 16 15
10
DC
10mS 100mS
14 13 12
5.5 6.0 6.5 7.0 8.0 10.0 0 20 40 ID/A 60 80 100
1
1
10
VDS/V
100
11
Fig.3. Safe operating area. Tmb = 25 C ID & IDM = f(VDS); IDM single pulse; parameter tp
Fig.6. Typical on-state resistance, Tj = 25 C. RDS(ON) = f(ID); parameter VGS
January 1999
3
Rev 1.000
Philips Semiconductors
Product specification
TrenchMOSTM transistor Standard level FET
BUK7615-100A
16
RDS(ON)/mOhm
3
a
Rds(on) normalised to 25degC
15
2.5
14
2
13
1.5
12
1
11
0.5 -100 -50 0 50 100 Tmb / degC 150 200
10
5
10
VGS/V
15
20
Fig.7. Typical on-state resistance, Tj = 25 C. RDS(ON) = f(VGS); conditions ID = 25 A;
100 ID/A
Fig.10. Normalised drain-source on-state resistance. a = RDS(ON)/RDS(ON)25 C = f(Tj); ID = 25 A; VGS = 5 V
VGS(TO) / V max.
BUK759-60
5
80
4 typ.
60
3 min.
40 Tj/C = 20 175 25
2
1
0
0
1
2
3
VGS/V
4
5
6
7
0 -100
-50
0
50 Tj / C
100
150
200
Fig.8. Typical transfer characteristics. ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj
90 gfs/S 80 70 60 50 40 30 20 10 0 0 20 40 ID/A 60 80 100
Fig.11. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS
Sub-Threshold Conduction
1E-01
1E-02 2% typ 98%
1E-03
1E-04
1E-05
1E-06
0
1
2
3
4
5
Fig.9. Typical transconductance, Tj = 25 C. gfs = f(ID); conditions: VDS = 25 V
Fig.12. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 C; VDS = VGS
January 1999
4
Rev 1.000
Philips Semiconductors
Product specification
TrenchMOSTM transistor Standard level FET
BUK7615-100A
11 10 9 8
120 110 100 90 80 70 60
Ciss
WDSS%
Thousands pF
7 6 5 4 3 2 1 0 0.01 0.1 1 VDS/V 10 Coss Crss 100
50 40 30 20 10 0 20 40 60 80 100 120 Tmb / C 140 160 180
Fig.13. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
12 VGS/V 10
Fig.16. Normalised avalanche energy rating. WDSS% = f(Tmb); conditions: ID = 75 A
+
L
VDS = 14V 80V
VDD
8
VDS VGS 0 RGS T.U.T. R 01 shunt
6
-ID/100
4
2
0
0
20
40
60 QG/nC
80
100
120
Fig.14. Typical turn-on gate-charge characteristics. VGS = f(QG); conditions: ID = 25 A; parameter VDS
100 ID/A 80
Fig.17. Avalanche energy test circuit. 2 WDSS = 0.5 LID BVDSS /(BVDSS - VDD )
+
RD VDS
Tj/C = 175 25
VDD
60
VGS 0 RG T.U.T.
-
40
20
0
0
0.1
0.2
0.3
0.4
0.5
0.6 0.7 VSDS/V
0.8
0.9
1
1.1
Fig.15. Typical reverse diode current. IF = f(VSDS); conditions: VGS = 0 V; parameter Tj
Fig.18. Switching test circuit.
January 1999
5
Rev 1.000
Philips Semiconductors
Product specification
TrenchMOSTM transistor Standard level FET
MECHANICAL DATA
Plastic single-ended package (Philips version of D2-PAK); 2 leads
BUK7615-100A
SOT404
A E A1
D1
D HD
Lp
b e e
c Q
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 4.5 4.1 A1 1.40 1.27 b 0.85 0.60 c 0.64 0.46 D 9.65 8.65 D1 1.6 1.2 E 10.3 9.7 e 2.54 Lp 2.9 2.1 HD 15.4 14.8 Q 2.60 2.20
OUTLINE VERSION SOT404
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-06-16
Fig.19. SOT404 surface mounting package. Centre pin connected to mounting base.
Notes 1. This product is supplied in anti-static packaging. The gate-source input must be protected against static discharge during transport or handling. 2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18. 3. Epoxy meets UL94 V0 at 1/8".
January 1999
6
Rev 1.000
Philips Semiconductors
Product specification
TrenchMOSTM transistor Standard level FET
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
BUK7615-100A
9.0
17.5 2.0
3.8
5.08
Fig.20. SOT404 : soldering pattern for surface mounting.
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
January 1999
7
Rev 1.000

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